Day 2 |
Wednesday, May 19, 2010 |
| 7:30 am to 8:30 am |
Continental Breakfast and Exhibits Open |
| 8:30 am to 8:40 am |
Welcome and Opening Remarks
Presented by: Neil Bolding, SGIA Printed Electronics and Membrane Switch Council Chairman |
| 8:40 am to 9:30 am |
Keynote: Integrating Advanced PCB Technologies Into The New Printed Electronics
Presented by: Robert Tarzwell, Consultant |
| 9:30 am to 10:15 am |
ASTM F01.18 Testing Standards Update/UL Certification Update
Presented by: Alan Burk, ASTM F01.18 Chairman
Ian McDonald, UL |
| 10:15 am to 11:00 am |
Break and Exhibits |
| 11:00 am to 11:50 am |
Long-Term Aging of Membrane Switches
Presented by: Don Banfield, Conductive Compounds |
| 11:50 am to 12:30 pm |
Outdoor Weathering Must Verify Accelerated Testing
Presented by: Q-panel |
| 12:30 pm to 1:50 pm |
Lunch and Exhibits |
| 1:50 pm to 2:35 pm |
The Right Choice: UV Testing or Xenon Arc Testing?
Presented by: Danica Zeise, Q-Panel |
| 2:35 pm to 3:25 pm |
Crimp Connector Systems for Membrane Switch and Printed Electronics
Presented by: Dave Fisher, Nicomatic |
| 3:25 pm to 4:05 pm |
Break and Exhibits |
| 4:05 pm to 4:50 pm |
Using Thermal Transfer Print Technology in Membrane Switches and Printed Electronics
Presented by: Claire Jalbert, IIMAK |
| 4:50 pm to 5:35 pm |
Environmentally Safe Flexible Printed Circuit Board by Roll-to-Roll Automation Printing Without Etching
Presented by: Chien-han Ho, Typotec |
| 5:35 pm to 5:55 pm |
Closing remarks
Presented by: Ray Greenwood, SGIA |
6:00 pm - 7:00 pm |
NEW EVENT!
Question and Answer Session with Keynote Speaker Robert Tarzwell: New Directions in Printed Electronics
Sponsored by: Conductive Compounds, FLEXcon, MacDermid Autotype Inc and Mathias Die Company |
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Day 3 |
Thursday, May 20, 2010 |
7:30 am to 8:30 am |
Continental Breakfast and Exhibits Open |
| 8:30 am to 8:35 am |
Day Two Opening Remarks
Presented by: Neil Bolding, SGIA Printed Electronics and Membrane Switch Council Chairman |
| 8:35 am to 9:25 am |
High Aspect Ratio Screen Printing of Fine-Line Conductive Thick-Film Ink on Crystalline Silicon Solar Cells
Presented by: Art Dobie, Sefar |
| 9:25 am to 10:10 am |
The Science of Accelerated Aging on Inks and Substrates
Presented by: Bea Purcell, Nazdar |
| 10:10 am to 11:00 am |
Break and Exhibits |
| 11:00 am to 11:50 pm |
Controlling 3-Dimensional Ink Deposition for Demanding High-Performance Screen Printed Applications
Presented by: Mike Young, Imagetek |
| 11:50 pm to 1:20 pm |
Lunch and Exhibits |
| 1:20 pm to 2:35 pm |
Panel Discussion: Technical Aspects of UV Curing Screen Print and Digital Processes
Moderated by: EIT
Panelists from: 3M, Nazdar, Kiwo, Phoseon |
| 2:35 pm to 3:20 pm |
Overcoming Challenges with Applied Adhesives on Digitally Printed UV Inks
Presented by: Lee Bryn, Kiwo
Lisa Castillo, Kiwo |
| 3:20 pm to 3:45 pm |
Break |
| 3:45 pm to 4:30 pm |
Substrates, Their Features and Latest Developments for Flexible Printed Electronics
Presented by: William Nelson, MacDermid Autotype |
| 4:30 pm to 5:15 pm |
Development of Conductive Ink for Capacitive Touch Screen Applications
Presented by: Jing Fan, Ph.D., Henkel
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| 5:15 pm to 5:30 pm |
Closing Remarks
Presented by: Neil Bolding, SGIA Printed Electronics and Membrane Switch Council Chairman |
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